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Technical specifications table

1. Basis brasses: oxygen-free copper

2. Basis brasses electrical resistivity: oxygen-free copper wire≤0.0165Ωmm2/m

3.Solder tin component:(1)63%Sn 37%b    (2)60%Sn 40%Pb  

(3)99%Sn 1%Ag     (4) 96.5%Sn 3.5%Ag

(5) 62%Sn 36%Pb 2%Ag

4.Solder tin melting point: 179—224℃

5.Tin thickness: One-side coated≥0.02mm

6.Extensibility: Soft phase≥25%,semi-soft phase≥15%

7.Width error:±0.05mm  Thickness error:±0.01mm

7.Packing:paper disk, ABS cylinder, paper box for cut off

 
 
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